# NSN 5961-00-206-1175: Semiconductor Device, Diode

NSN 5961-00-206-1175 (also written 5961002061175; NIIN 00-206-1175) is a semiconductor device, diode in Federal Supply Class 5961, Semiconductor Devices and Associated Hardware. 5 manufacturer part numbers from 5 suppliers are on record. It was last purchased in Sep 2026.

## Identification

- NSN: 5961-00-206-1175 (5961002061175)
- NIIN: 00-206-1175 (002061175)
- Item name: SEMICONDUCTOR DEVICE,DIODE
- Federal Supply Class: [FSC 5961 Semiconductor Devices and Associated Hardware](https://nsnexplorer.com/fsc/5961/)
- Federal Supply Group: [FSG 59](https://nsnexplorer.com/group/59/)
- Acquisition method suffix code: AMSC G: the government has a complete data package and the rights to use it. (observed 2026-10-10)
- Acquisition method code: 1

## Characteristics

| Code | Requirement | Reply |
| --- | --- | --- |
| CCDG | OVERALL WIDTH ACROSS FLATS | INCHES MINIMUM 1.218 AND INCHES MAXIMUM 1.250 |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | NOMINAL NOMINAL REGULATOR VOLTAGE 36.0 |
| ABHP | OVERALL LENGTH | INCHES MINIMUM 2.963 AND INCHES MAXIMUM 3.078 |
| MATT | MATERIAL | SEMICONDUCTOR SILICON |
| THSD | THREAD SERIES DESIGNATOR | UNF |
| TTQY | TERMINAL TYPE AND QUANTITY | THREADED STUD 1 AND THREADED HOLE 1 |
| CQJX | NOMINAL THREAD SIZE | INCHES 0.750 |
| CBBL | FEATURES PROVIDED | MOUNTING HARDWARE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | CELSIUS CASE 175.0 |
| MATT | MATERIAL | ENCLOSURE CERAMIC |
| AXGY | MOUNTING METHOD | THREADED STUD(S) |
| AFZC | FUNCTION FOR WHICH DESIGNED | ZENER DIODE |
| AKPV | MOUNTING FACILITY QUANTITY | 1 |

## Part numbers

| Part number | CAGE | Supplier | Source |
| --- | --- | --- | --- |
| 7939981 | 16758 | GENERAL MOTORS CORP DELCO ELECTRONICS DIV | [flis](https://www.dla.mil/Portals/104/Documents/InformationOperations/LogisticsInformationServices/FOIA/PUBLOG/) |
| 89-8000 | 81483 | INFINEON TECHNOLOGIES AMERICAS CORP | [flis](https://www.dla.mil/Portals/104/Documents/InformationOperations/LogisticsInformationServices/FOIA/PUBLOG/) |
| KCII/1243 | 5N063 | KOEHLKE COMPONENTS INC | [flis](https://www.dla.mil/Portals/104/Documents/InformationOperations/LogisticsInformationServices/FOIA/PUBLOG/) |
| SM-C-745210 | 31338 | SEMITRONICS CORP | [flis](https://www.dla.mil/Portals/104/Documents/InformationOperations/LogisticsInformationServices/FOIA/PUBLOG/) |
| SM-C-745210 | 80063 | US ARMY COMMUNICATIONS & ELECTRONICS MATERIEL READINESS COMMAND LOGISTICS ENGINEERING DIR | [flis](https://www.dla.mil/Portals/104/Documents/InformationOperations/LogisticsInformationServices/FOIA/PUBLOG/) |

## Contract awards

Newest first.

| Date | Award | Description | Recipient | Amount |
| --- | --- | --- | --- | --- |
| 2026-09-28 | [SPE7M026P4900](https://www.dibbs.bsm.dla.mil/Awards/AwdRecs.aspx?category=awdnsn&TypeSrch=cq&Value=5961002061175) | SEMICONDUCTOR DEVIC | LINTECH COMPONENTS CO. INC. DBA LINTECH COMPONENTS CO INC | $28,259.60 |

## Sources

- DLA DIBBS RFQs for this NSN: https://www.dibbs.bsm.dla.mil/RFQ/RFQNsn.aspx?value=5961002061175&category=nsn
- DLA DIBBS awards for this NSN: https://www.dibbs.bsm.dla.mil/Awards/AwdRecs.aspx?category=awdnsn&TypeSrch=cq&Value=5961002061175
- AMSC record: https://www.dla.mil/Portals/104/Documents/InformationOperations/LogisticsInformationServices/FOIA/PUBLOG/
- USAspending contract actions (each award above links to its record)
- All data is public U.S. government data; every row above links to its source record where one exists.

Canonical page: https://nsnexplorer.com/nsn/5961-00-206-1175/
JSON: https://nsnexplorer.com/api/nsn/5961-00-206-1175.json