# NSN 5961-00-119-9119: Semiconductor Device, Diode

NSN 5961-00-119-9119 (also written 5961001199119; NIIN 00-119-9119) is a semiconductor device, diode in Federal Supply Class 5961, Semiconductor Devices and Associated Hardware. 2 manufacturer part numbers from 2 suppliers are on record. It was last purchased in Sep 2026.

## Identification

- NSN: 5961-00-119-9119 (5961001199119)
- NIIN: 00-119-9119 (001199119)
- Item name: SEMICONDUCTOR DEVICE,DIODE
- Federal Supply Class: [FSC 5961 Semiconductor Devices and Associated Hardware](https://nsnexplorer.com/fsc/5961/)
- Federal Supply Group: [FSG 59](https://nsnexplorer.com/group/59/)
- Acquisition method suffix code: AMSC L: annual buy value is below the screening threshold. (observed 2026-10-10)
- Acquisition method code: 3

## Characteristics

| Code | Requirement | Reply |
| --- | --- | --- |
| ABHP | OVERALL LENGTH | INCHES NOMINAL 0.085 |
| ABJT | TERMINAL LENGTH | INCHES NOMINAL 0.055 |
| ADAV | OVERALL DIAMETER | INCHES NOMINAL 0.085 |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | MAXIMUM NOMINAL REGULATOR VOLTAGE 100.0 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE 0.75 |
| CTRD | POWER RATING PER CHARACTERISTIC | WATTS MAXIMUM TOTAL POWER DISSIPATION 1.0 |
| MATT | MATERIAL | ENCLOSURE GLASS |
| MATT | MATERIAL | SEMICONDUCTOR SILICON |
| TTQY | TERMINAL TYPE AND QUANTITY | UNINSULATED WIRE LEAD 2 |

## Part numbers

| Part number | CAGE | Supplier | Source |
| --- | --- | --- | --- |
| 60101-004 | 74063 | TE CONNECTIVITY CORPORATION | [flis](https://www.dla.mil/Portals/104/Documents/InformationOperations/LogisticsInformationServices/FOIA/PUBLOG/) |
| UT112 | 12969 | MICRO USPD INC | [flis](https://www.dla.mil/Portals/104/Documents/InformationOperations/LogisticsInformationServices/FOIA/PUBLOG/) |

## Price history

Newest first.

| Date | Unit price | Quantity | Supplier | Agency | Source |
| --- | --- | --- | --- | --- | --- |
| 2026-09-29 | $4,645.00 | 1 | LINTECH COMPONENTS CO. INC. DBA LINTECH COMPONENTS CO INC | — | [record](https://www.dibbs.bsm.dla.mil/Awards/AwdRecs.aspx?category=awdnsn&TypeSrch=cq&Value=5961001199119) |

## Contract awards

Newest first.

| Date | Award | Description | Recipient | Amount |
| --- | --- | --- | --- | --- |
| 2026-09-29 | [SPE7M526P5337](https://www.dibbs.bsm.dla.mil/Awards/AwdRecs.aspx?category=awdnsn&TypeSrch=cq&Value=5961001199119) | SEMICONDUCTOR DEVIC | LINTECH COMPONENTS CO. INC. DBA LINTECH COMPONENTS CO INC | $4,645.00 |

## Sources

- DLA DIBBS RFQs for this NSN: https://www.dibbs.bsm.dla.mil/RFQ/RFQNsn.aspx?value=5961001199119&category=nsn
- DLA DIBBS awards for this NSN: https://www.dibbs.bsm.dla.mil/Awards/AwdRecs.aspx?category=awdnsn&TypeSrch=cq&Value=5961001199119
- AMSC record: https://www.dla.mil/Portals/104/Documents/InformationOperations/LogisticsInformationServices/FOIA/PUBLOG/
- USAspending contract actions (each award above links to its record)
- All data is public U.S. government data; every row above links to its source record where one exists.

Canonical page: https://nsnexplorer.com/nsn/5961-00-119-9119/
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